Page 22 - Chips Components News Today : Breaking News, Live Updates & Top Stories | Vimarsana

SK Hynix has announced the development of its 12-layer HBM3 product with a 24GB memory capacity, the industry's largest, with customer performance evaluation of samples currently underway.

Himax CEO Jordan Wu noted at a forum concerning Taiwan's IC design that many Taiwanese IC design houses have been able to achieve profitability. But despite the profits, they are still striving to secure government support or even trying to influence the government's policies. Why is that so? Wu pointed out that IC design is a knowledge-intensive sector that attracts global attention. Policies concerning IC design are unlike those for most other industry sectors and their making must take international competition into consideration.

The German state of Saxony is expanding scientific cooperation with Taiwan.

Vedanta, the front-runner among applicants for India's INR760 billion (US$92 billion) semiconductor and display fabs incentive scheme, is looking to begin chipmaking in 2027 and may establish an OSAT plant as well as a wafer fab.

As the US restricts beneficiaries under the CHIPS Act from greatly expanding or upgrading their investments in China, analysts believe that global memory production will tilt toward South Korea and the US, with Samsung and SK Hynix benefiting the most.