Share this article Share this article TAICHUNG, Taiwan and MOUNTAIN VIEW, Calif., Jan. 26, 2021 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix ® for demanding Artificial Intelligence (AI) applications such as object recognition. (PRNewsfoto/Flex Logix Technologies, Inc.) (PRNewsfoto/Flex Logix Technologies, Inc.) The Winbond LPDDR4X chip is being paired with Flex Logix's InferX™...