Winbond Keeps Expanding DDR3 SDRAM Production
/PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced key enhancements to its DDR3...
Source: prnewswire.com
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Winbond W77Q Secure Flash gains further endorsement with FIPS 140-3 Automated Cryptographic Validation Test System
/PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that their TrustME® W77Q Secure...
Source: prnewswire.com
Winbond TrustME® W77Q Secure Flash Obtains Common Criteria EAL2 and ISO 26262 ASIL-C Ready Certifications
/PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the company's TrustME® W77Q...
Source: prnewswire.com
Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
Share this article Share this article TAICHUNG, Taiwan and MOUNTAIN VIEW, Calif., Jan. 26, 2021 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix ® for demanding Artificial Intelligence (AI) applications such as object recognition. (PRNewsfoto/Flex Logix Technologies, Inc.) (PRNewsfoto/Flex Logix Technologies, Inc.) The Winbond LPDDR4X chip is being paired with Flex Logix's InferX™...
Source: prnewswire.com