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GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

Published: October 27, 2022

Results highlight how deep data performance and reliability monitoring delivers comprehensive visibility into high bandwidth interfaces

Source: design-reuse.com

Related Topics:

United StatesEvelyn LandmanIgor ElkanovichTaiwan Stock ExchangeGlobal Unichip CorporationChiplet Interconnect Express ConsortiumSolutions ToTest Chip Uses In MonitoringDeep Data AnalyticsHigh Bandwidth Die To CharacterizationCase StudyReliability MonitoringHeterogeneous PackagingCombining Deep DataMachine Learning AlgorithmsNorth AmericaHeterogeneous IntegrationEmerging SolutionsUniversal Chiplet Interconnect ExpressHsin Chu TaiwanIe To Die

GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

Published: October 26, 2022

/PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC...

Source: prnewswire.com

Related Topics:

United StatesEvelyn LandmanIgor ElkanovichTaiwan Stock ExchangeGlobal Unichip CorporationChiplet Interconnect Express ConsortiumSolutions ToTest Chip Uses In MonitoringDeep Data AnalyticsHigh Bandwidth Die To CharacterizationCase StudyReliability MonitoringHeterogeneous PackagingCombining Deep DataMachine Learning AlgorithmsNorth AmericaHeterogeneous IntegrationEmerging SolutionsUniversal Chiplet Interconnect ExpressHsin Chu Taiwan