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Murata has announced the formation of an alliance that will provide combined services leveraging mobile cellular connectivity, cloud services, and a device connectivity management platform (CMP) for globally distributed internet of things (IoT) applications.
ECM Reform through the Design Work Improvement Project
SEATTLE, August 02, 2023--Soracom, Inc., a global provider of advanced Internet of Things (IoT) connectivity, today announced an expanded partnership to support commercial deployment of next-generation iSIM (Integrated Subscriber Identity Module) for Soracom customers. In June 2021, Soracom announced completion of a joint iSIM Proof of Concept in collaboration with Sony Semiconductor Israel (Sony), a leading cellular IoT chipset provider, and Kigen, a global leader in secure authentication for c
Embedded World 2023, held last month in Nuremberg, looked to provide a platform for the embedded community and with over 950 exhibitors it certainly afforded exhibitors an opportunity to demonstrate the very latest embedded technologies whether modules, operating systems, hardware and software designs, M2M communications, services, or complex system designs.
Murata has announced the introduction of the LBES5PL2EL module which has been designed to meet the demands of next generation IoT hardware - where having Matter connectivity is set to become an increasingly important expectation.