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TDK collaborates with Texas Instruments on new i3 Micro Module, the world's first sensor module with built-in edge AI and wireless mesh connectivity – EEJournal

• Ultracompact, battery-powered wireless multi-sensor module, facilitating the prediction of anomalies in machinery and equipment • Integrates the TI CC2652R7 SimpleLink™ wireless MCU for real-time monitoring • Enables ongoing global evolution toward smart factories with implementation of Condition-based Monitoring (CbM) January 5, 2023 TDK Corporation (TSE:6762) today announced the TDK i3 Micro Module, the world’s… ....

United States , Nick Smith , Christian Hoffman , Las Vegas , Corporate Marketing Group , Texas Instruments , Consumer Electronics Show , Condition Based Monitoring , General Manager , Intelligent Industrial Internet ,

Precision medium bandwidth signal chain connects multiple sensors

ADI has introduced a precision medium bandwidth signal chain platform improving system performance for signal bandwidths of DC to approximately 500kHz ....

Analog Devices , Condition Based Monitoring , Medium Bandwidth Key Features , Dynamic Signal Analysis , Blow Noise , Module Data Acquisition ,