Tektronix Wins DesignCon 2023 Best Paper Award for Work in Data-Driven PAM4 SerDes Modelling
In partnership with Hewlett Packard Enterprise, Tektronix is recognized for its outstanding work
Source: valdostadailytimes.com
Stay updated with breaking news from Des Modeling. Get real-time updates on events, politics, business, and more. Visit us for reliable news and exclusive interviews.
In partnership with Hewlett Packard Enterprise, Tektronix is recognized for its outstanding work
SANTA CLARA, CA / ACCESSWIRE / April 20, 2023 / DesignCon, the nation's premiere event for chip, board, and systems design engineers, reveals the winning technical papers of the 2023 Best Paper Awards.