The Emergence of 2.5D Custom SoCs and Chiplets in AI and HPC Applications
The Emergence of 2.5D Custom SoCs and Chiplets in AI and HPC Applications Webinar Overview 2021 promises to be the breakthrough year when 2.5D based custom SoCs and chiplets will play a very prominent role in turbo-charging cloud/AI, HPC, networking and storage applications. Join us for this webinar to learn more about how OpenFive is collaborating with our customers and partners to drive domain-specific innovations in Die-to-Die (D2D) IP, custom silicon and advanced package design methodologies. Key Learnings: Who Should Attend?: Speaker VP, Product & Corporate Marketing Sudhir Mallya is Vic...