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Time Sensitive Network Interoperability

Semiconductor Embedded Services Market Size Forecast to Reach $109.4 Billion by 2026

Semiconductor Embedded Services Market Size Forecast to Reach $109.4 Billion by 2026

800G/400G Ethernet Solutions for Networking and Chiplets Webinar Overview Ethernet has been used as a mainstream solution for chip-to-chip and die-to-die connectivity. In this webinar, we will review some of the key required features of Ethernet MAC/PCS from 800G down to 10G. We will address various types of Forward Error Correction engines (FEC) to improve the BER of the channel/links. We will analyze how the latest advances in packaging technology have allowed moving the ethernet functions from the main die to chiplets simplifying the system and improving the cost/power/performance of the o...

The Emergence of 2.5D Custom SoCs and Chiplets in AI and HPC Applications Webinar Overview 2021 promises to be the breakthrough year when 2.5D based custom SoCs and chiplets will play a very prominent role in turbo-charging cloud/AI, HPC, networking and storage applications. Join us for this webinar to learn more about how OpenFive is collaborating with our customers and partners to drive domain-specific innovations in Die-to-Die (D2D) IP, custom silicon and advanced package design methodologies. Key Learnings: Who Should Attend?: Speaker VP, Product & Corporate Marketing Sudhir Mallya is Vic...