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CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

Published: November 20, 2023

Biden-Harris administration outlines how the program will boost U.S. advanced packaging capabilities for semiconductors.

Source: nist.gov

Related Topics:

United StatesFlora WeissLauriee LocascioAmerica Subramanian IyerGina RaimondoDepartment Of CommerceProgram OfficeNational Advanced Packaging Manufacturing ProgramNational Semiconductor Technology CenterDevelopment Rd OfficeNational Institute Of StandardsMorgan State UniversityUnder SecretaryNational InstituteDirector LauriePresident BidenCommerce GinaNational Advanced Packaging ManufacturingDevelopment Director LoraSubramanian Iyer