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SK Hynix confirms $3.87 billion investment in Indiana advanced chip packaging facility

SK Hynix confirms $3.87 billion investment in Indiana advanced chip packaging facility
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Multi-billion-dollar investment will make Indiana leader in semiconductor packaging

WEST LAFAYETTE, Ind. - Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg, and Purdue University President Mung Chiang joined executives . ....

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South Korean chip maker to build $3.87 billion manufacturing plant in Indiana

Semiconductor factory will help the U.S. to “onshore more of its critical chip supply chain.” ....

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Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging
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Gov. Holcomb, IEDC announce generational

Gov. Holcomb, IEDC announce generational
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