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TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE(TM) Preforms

Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors

[1] Bonding: Refers to shear strength (strength determined through application of a lateral load during testing)[2] Bumps: Protruding electrodes[3] Squeegees: Tools made from rubber or polyurethane resin that are used to scrape off excess material[4] Electroless plating: Refers to plating applied through a chemical reaction without using electricity; it enables plating of certain metals and precious metals, including copper,...