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ASIP and APACT have partnered to establish a hi-tech semiconductor assembling and testing facility in Hyderabad, aiming to contribute to India's semiconductor manufacturing growth. They have also signed an MoU with IIT Hyderabad for R&D collaboration in the OSAT industry.
OSAT (Outsourced Semiconductor Assembly and Testing) and ATMP (Assembly Testing Marking and Packing), Hyderabad facility will serve India’s growing domestic needs, and provide an alternate supply chain to the global ecosystem.
India News: HYDERABAD: Advanced System in Package Technologies (ASIP), founded by Silicon Valley professionals, has entered into a joint venture with South Korean.
Dublin, Feb. 20, 2024 (GLOBE NEWSWIRE) -- The
With a strategic focus on Computing, Communication, Automotive & Mobility, Strategic Electronics, and Industrial IoT, the Digital India futureLABS initiative is set to leverage cutting-edge technologies such as AI, big data, and quantum computing, signalling a pivotal shift in India's technological landscape.