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Embedded Engineering : Making Opensource USB C industrial camera with Interchangeable C mount lens, Interchangeable MIPI Sensor with Lattice Crosslink NX FPGA and Cypress FX3 USB 3.0 controller

Embedded Engineering : Making Opensource USB C industrial camera with Interchangeable C mount lens, Interchangeable MIPI Sensor with Lattice Crosslink NX FPGA and Cypress FX3 USB 3.0 controller
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Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices – Consumer Electronics Net

2 months ago
New Lattice MachXO2ZE FPGA Options Deliver High Density I/O Support at Small Size, Low Power to Enable Smart Consumer and Industrial IoT Edge Devices
HILLSBORO, Ore.–(BUSINESS WIRE)–Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced new versions of the Lattice MachXO2ZE™ FPGA family with wafer level chip-scale packaging (WLCSP) and increased I/O density. With package sizes as small as 2.5 x 2.5 mm, standby power levels as low as 22 μW, and up to 63 general-purpose I/Os (GPIO), MachXO2ZE FPGAs are a compelling hardware platform for signal bridging and/or interface applications in smart consumer and industrial IoT devices operating at the network Edge. ....

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