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Asia's first Transnational R&D Consortium on AI Chip Design Established

Published: November 30, 2021

The Hong Kong University of Science and Technology (HKUST) has established Asia’s first transnational consortium to perform research and development

Source: miragenews.com

Related Topics:

Hong KongUniversity Of Hong KongHong Kong GeneralAi Chip CenterCenter ProfChinese University Of Hong KongStanford UniversityHong Kong University Of ScienceHong Kong UniversityEmerging Smart SystemsChinese UniversityFounding DirectorElectronic Design AutomationArtificial Intelligence

Asia's first Transnational R&D Consortium on AI Chip Design Established

Published: November 30, 2021

The Hong Kong University of Science and Technology (HKUST) has established Asia’s first transnational consortium to perform research and development

Source: miragenews.com

Related Topics:

Hong KongUniversity Of Hong KongHong Kong GeneralAi Chip CenterCenter ProfChinese University Of Hong KongStanford UniversityHong Kong University Of ScienceHong Kong UniversityEmerging Smart SystemsChinese UniversityFounding DirectorElectronic Design AutomationArtificial Intelligence