Despite being handicapped by U.S. sanctions, Huawei and SMIC have a plan to produce 3nm chips
Multiple patents indicate that Huawei and SMIC have a way to make 3nm chips using older DUV lithography machines.
Source: phonearena.com
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Huawei & SMIC to build 5nm chip without EUV machines
SMIC will be able to make a 5nm chip for Huawei without using modern EUV lithography machines. This is how...
Source: androidheadlines.com
Intel reveals chip plans
Gelsinger tries to put a silver lining into disappointing results Despite Intel's disappointing results, the company used the announcement to reve...
Source: fudzilla.com
US Commerce Secretary: Huawei's Kirin 9000 Chip Inferior to American Processors
US Commerce Secretary Gina Raimondo criticizes Huawei's Kirin 9000 SoC, arguing it's less advanced than US processors.
Source: techtimes.com
Intel finishes assembly of ASML's first High-NA EUV tool, ready for Intel 14A process in 2025
Intel Foundry confirms it has completed the assembly of the industry's first commercial High-NA EUV lithography machine at its D1X fab in Oregon, USA.
Source: tweaktown.com