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Advanced Packaging market has 10.6% CAGR to hit $79bn in 2028

The Advanced Packaging market, valued at $44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022 to 2028, reaching $78.6 billion in 2028, ....

Yole Bilal Hachemi , Flip Chip Scale Package , Embedded Die , Bilal Hachemi ,

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it ....

United States , Johnw Mitchell , Us Congress , Technologist Council , Ic Substrate Manufacturing Center , Flip Chip Ball Grid Array , Flip Chip Scale Package , Manufacturing Center , President Biden , Communications Director ,

Huawei HiSilicon is BACK!!! Set to launch a new flagship Kirin chip

Huawei HiSilicon is BACK!!! Set to launch a new flagship Kirin chip. However, this chip is not ready for mass production ....

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Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn
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United States , Johnw Mitchell , Us Congress , Technologist Council , Ic Substrate Manufacturing Center , Flip Chip Ball Grid Array , Flip Chip Scale Package , Manufacturing Center , President Biden ,