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NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM

Published: December 6, 2023

Innovative 3D floating body cell with a unique dual-gate structure delivers high sensing margins, retention times, and endurance cycles

Source: valdostadailytimes.com

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United StatesSouth KoreaSoult UkpyolsiRepublic Of KoreaJay KramerSandy HsuMaya LustigInternational Memory WorkshopNetwork Storage Advisors IncElectron Devices SocietyFloating Body CellJay Kramer PresidentNetwork Storage AdvisorsMemory WorkshopDevices SocietySan JoseAnalyst Contact

NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory

Published: June 29, 2023

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D

Source: nextbigfuture.com

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United StatesRyzen CpusSandy HsuBrian WangNeo SemiconductorSingularity UniversityHead Of ResearchSan JoseFloating Body CellFuturist Thought LeaderArtificial IntelligenceAnti Aging BiotechnologyAngel Investor