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Intel says it will squeeze 1 trillion transistors onto a chip package by 2030 - SiliconANGLE

Intel researchers have announced a number of technological innovations and concepts, including packaging improvements that could result in computer chips that are ten times as powerful as today’s most advanced silicon.

Intel introduces quasi-monolithic chips for next-gen 3D packaging, teases an incredible 1 trillion transistors on a single package by 2030.

Intel announced that it will be able to stuff one trillion transistors into an IC package by 2030.

Thirty years ago, Dan Haifley helped change the California coast from the driver’s seat of his 1972 Ford Pinto. As the only staff member of Save Our Shores, he drove up and down the coast urging communities to prevent oil companies from offshore drilling. Those presentations helped create a bulwark against drilling among coastal towns and were the first steps in the establishment of the Monterey Bay National Marine Sanctuary. But there is still much to do — and he has ideas on how you can get started volunteering and making a difference.