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/ Staff writer, with CNAUnited Microelectronics Corp （UMC, 聯電） yesterday declined to comment on a report that the White House had invited the nation’s second-largest contract chipmaker to build a semiconductor fab in Detroit.
United Microelectronics Corp (UMC, 聯電) yesterday declined to comment on a report that the White House had invited the nation’s second-largest contract chipmaker to build a semiconductor fab in Detroit. UMC said it would not comment on market speculation, but said it had adopted a policy to diversify production and was continuing to assess the possibility of investments abroad. A report published by the Chinese-language Economic Daily News said that UMC had been invited by the US government to build a 12-inch fab in Detroit. Such an investment would follow similar moves by Taiwan Semicond...
GlobalWafers Inc (環球晶圓), the world’s No. 3 silicon wafer supplier, yesterday said that a new 12-inch fab to be built in Italy would begin operations in the second half of next year to meet customer demand. The fab, the first 12-inch fabrication facility in Italy, has received robust support from European customers, the Hsinchu-based company said. Construction would begin as soon as subsidies are approved, it said, adding that it expects to receive funds from the Italian government and from a new EU project that aims to build a more resilient chip supply chain in Europe. “Demand re...
DRAM chip supplier Winbond Electronics Corp (華邦電子) is forecast to increase capital expenditure by 367 percent year-on-year to US$1.65 billion this year, the biggest hike in the global semiconductor industry, where the average increase is estimated to be 24 percent, market information advisory firm IC Insights said on Monday. US-based GlobalFoundries Inc came second in terms of spending growth, as the company’s capital expenditure is forecast to be US$4.5 billion, up 155 percent from last year, IC Insights said in a research note. Nanya Technology Corp (南亞科技), another Taiwanes...
United Microelectronics Corp (UMC, 聯電), the world’s third-largest contract chipmaker, is to invest US$5 billion in a new manufacturing facility in Singapore to make 22-nanometer chips, it said yesterday. The first phase of the investment would add 30,000 12-inch wafers per month to UMC’s capacity, with production expected to start in 2024, the Hsinchu-based chipmaker said in a statement. The new facility would be built next to UMC’s other Singapore 12-inch fab, Fab12i. The new plant comes as chip supply remains tight due to demand from 5G applications, Internet-of-Things devices and ...