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Taiwan-based PCB maker Zhen Ding Technology has drawn plans to expand its production capacity worldwide. According to company chairman Charles Shen, in addition to its existing factories in China, Taiwan, and India, the company is looking at additional production sites in Southeast Asia.
Due to the rapid advancement in communication technology, the commercialization of 6G is expected to take place by 2030, marking a significant reduction in the innovation cycle.
Specialty DRAM and flash memory maker Winbond Electronics has seen its foundry utilization rates begin to recover, anticipating a return to monthly profits in the second quarter.
Nvidia's supply chain strives to be as diverse and decentralized as possible, and the company is open to working with Intel, according to Jensen Huang, CEO for the fabless vendor.
The proliferation of generative AI and the growing adoption of Qualcomm's in-house developed Oryon CPU will help the company's PC-related processor business achieve breakthrough results in 2024, according to Kedar Kondap, SVP and GM of compute and gaming for the US chip vendor.