Rise in AI chip orders boosts WinWay revenue in May
WinWay Technology, a provider of IC test interface solutions, saw its May revenue climb nearly 60% sequentially, buoyed by a surge in orders for AI and HPC chips.
Source: digitimes.com
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Apple UltraFusion relies on TSMC 3DFabric packaging technology
Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.
Source: digitimes.com
SMIC subsidiary continues to fulfill Chinese demands for FinFET capabilities
Following a DIGITIMES Asia report in mid-May indicating that Chinese foundry SMIC has , recent Chinese media reports suggested that SMIC's Shanghai-based subsidiary, Semiconductor Manufacturing South Corp., continues to offer manufacturing service at 14nm and below.
Source: digitimes.com
CWTC likely to report higher-than-anticipated 2Q23 revenue
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely to report higher-than-anticipated revenue for the second quarter of 2023, according to the company.
Source: digitimes.com
Global 1Q23 enterprise SSD revenue falls by nearly half
Due to a slump in both volume and prices, revenue in the enterprise SSD market fell 47.3% sequentially to nearly US$2 billion in the first quarter of 2023, according to TrendForce.
Source: digitimes.com