Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.
Source: tweaktown.com
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NVIDIA Grace CPU: 72 Arm v9.0 cores, TSMC 4N, PCIe 5.0, 500W power
NVIDIA's new Grace CPU detailed: 72 Arm v9.0 cores per chip, 117MB of L3 cache, 68 x PCIe 5.0 lanes, TSMC 4N process node, and 500W TDP.
Source: tweaktown.com
Tesla Dojo Custom AI Supercomputer at HC34
At Hot Chips 34, we got a glimpse of the Tesla Dojo custom AI supercomputer, its V1 Interface NICs with HBM and how it scales data loading
Source: servethehome.com
Intel is on a collision course with Nvidia, AMD in a key battleground
Intel has published performance benchmarks for its new Ponte Vecchio HPC GPU.
Source: techradar.com
Intel shows off Meteor Lake-P CPU: 2023 laptops with 6P+8E CPU power
Intel teases Foveros 3D packaging technology: Meteor Lake-P CPUs in 2023 laptops teased with 6P+8E CPU diagram showed off at Hot Chips 34 conference.
Source: tweaktown.com