Intel says its chip stacking method will usher a new era of semiconductors
Intel's CEO said the company aims to move from 100bn transistors to 1trn by 2030, through various innovations such as 'chiplet' technology.
Source: siliconrepublic.com
Page 21 - Hot Chips News Today : Breaking News, Live Updates & Top Stories | Vimarsana
Stay updated with breaking news from Hot Chips. Get real-time updates on events, politics, business, and more. Visit us for reliable news and exclusive interviews.
Top News In Hot Chips Today - Breaking & Trending Today
Intel wants to achieve 1 trillion transistors on a package by 2030 using chiplets
Intel's 13th-gen Core processors are on the horizon, but they shouldn't stray too far from their predecessors regarding microarchitecture. After all, Intel uses the same Intel 7...
Source: techspot.com
AMD unveils MI250X MCM GPU diagram: 58 billion transistors, 6nm TSMC
AMD shows off the GPU block diagram for its Instinct MI250X: MCM GPU, 58 billion transistors, TSMC 6nm process node, 128GB of HBM2e memory.
Source: tweaktown.com
Intel: our new Ponte Vecchio GPU is 2.5x faster than NVIDIA A100 GPU
Intel's next-gen Ponte Vecchio GPUs on the new Sapphire Rapids HBM server platform: up to 2.5x faster than NVIDIA's Ampere-based A100 GPU.
Source: tweaktown.com
Intel Details 3D Chip Packaging Tech for Meteor Lake, Arrow Lake and Lunar Lake
Intel detailed its 3D Foveros chiplet packaging technology for its Meteor Lake, Arrow Lake and Lunar Lake processors at Hot Chips 34.
Source: tomshardware.com