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Top News In Embedded Multi Die Interconnect Bridge Today - Breaking & Trending Today

Kaby Lake-G chip back from the grave, now on NAS motherboard

Kaby Lake-G chip back from the grave, now on NAS motherboard
theregister.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from theregister.com Daily Mail and Mail on Sunday newspapers.

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Intel Bridges AI Chip Gap (NASDAQ:INTC)

Intel Bridges AI Chip Gap (NASDAQ:INTC)
seekingalpha.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from seekingalpha.com Daily Mail and Mail on Sunday newspapers.

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Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced… ....

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What caught your eye this week? (Veloce CS, Softbank, ISSCC, UKSA)

The Electronics Weekly team share some fingerposts - their picks of the week, in terms of announcements, developments, quotes or anything else in the wide world of electronics that caught their eye. ....

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Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration - High-Performance Computing News Analysis

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded [.] ....

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