Cadence and Intel Foundry Collaborate to Enable Heterogeneou

Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced…

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Rahul Goyal , Michael Jackson , Group At Cadence , Intel , Intel Foundry , Embedded Multi Die Interconnect Bridge , Integrity System Planner , Verification System , Corporate Vice President , Vice President , General Manager , Design Ecosystem ,

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