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Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced… ....

Rahul Goyal , Michael Jackson , Group At Cadence , Intel Foundry , Embedded Multi Die Interconnect Bridge , Integrity System Planner , Verification System , Corporate Vice President , Vice President , General Manager , Design Ecosystem ,

Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration - High-Performance Computing News Analysis

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded [.] ....

Rahul Goyal , Michael Jackson , Group At Cadence , Intel Foundry , Embedded Multi Die Interconnect Bridge , Integrity System Planner , Virtuoso Studio , Pegasus Verification System , Corporate Vice President , Vice President , General Manager , Design Ecosystem ,

New institute accelerates future of microelectronic system integration, advanced packaging

New institute accelerates future of microelectronic system integration, advanced packaging
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

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Purdue collaborates to bolster rapid technology development in U.S.

WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda . ....

Purdue University , United States , Todd Younkin , Tom Beckley , Ganesh Subbarayan , Mark Lundstrom , Luc Van , Dave Henshall , Purdue Jamesg Dwyer , Nikhilesh Chawla , Eric Holcomb , John Underwood , Katsuaki Suganuma , Ivy Tech Community College , Semiconductor Degrees Program , Osaka University , Birck Nanotechnology Center , Semiconductor Research Corporation , Group At Cadence , Crane Division , Us Department Of Defense , D Integration Laboratory At Osaka University , Cadence Design Systems , Naval Surface Warfare Center , Enhanced Semiconductors , Heterogenous Integration Research In Packaging ,

Sourceability & Cadence: Boosting Market Intel for Engineers

Sourceability® & Cadence unite, offering groundbreaking market insights with Datalynq™, setting new industry standards. ....

Yashar Shahabi , Michael Jackson , Group At Cadence , Cadence Design Systems Inc , Digital Solutions Technology At Sourceability , A Partnership Driving Innovation , Cadence Design Systems , Electronic Component Market , Innovative Product , Data Acquisition , Sensors Awards , Partnership Driving , Senior Vice President , Digital Solutions , Corporate Vice President ,