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Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced… ....
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded [.] ....
New institute accelerates future of microelectronic system integration, advanced packaging purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.
WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda . ....