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WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda ...
From creating microchip ‘clocks’ to authoring a book series on semiconductors, Purdue continues to forge the future of microelectronics in 2023. Purdue University’s persistent pursuit of microchip advancement through the innovation, partnerships and programs highlighted in this roundup continues to move the field forward. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel, bhuchel@purdue.edu.
Carol Handwerker’s life’s work is aimed at increasing reliability in everything from the largest Navy carrier to the family car. She does it by researching probably the most inconspicuous material: solder.
With a $735,000 grant from the Semiconductor Research Corporation, the university aims to ramp up research and workforce development in microelectronics to tackle supply chain issues and build next-generation technology.