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Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases

Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases
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Intel wants to achieve 1 trillion transistors on a package by 2030 using chiplets

Intel's 13th-gen Core processors are on the horizon, but they shouldn't stray too far from their predecessors regarding microarchitecture. After all, Intel uses the same Intel 7. ....

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Intel Says UCIe to Outpace PCIe in Speed Race

Intel Says UCIe to Outpace PCIe in Speed Race
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Intel Says UCIe to Outpace PCIe in Speed Race

Intel Says UCIe to Outpace PCIe in Speed Race
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Chiplets Enter The Supercomputer Race

Chiplets Enter The Supercomputer Race
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