Out Chip News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Siemens, ASE Introduce Enablement Technologies for Next-Gen High Density Advanced Package Designs Siemens Digital Industries Software has announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation. The new high-dens...

ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics. “By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through int...