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New Electronics - Siemens collaborates with Intel Foundry to develop EMIB reference flow

Siemens Digital Industries Software is collaborating with the Intel Foundry in the development of a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. ....

Rahul Goyal , Package Assembly Design Kit , Leveraging Siemen , Vice President , General Manager , Design Ecosystem , Intel Foundry , Xpedition Substrate Integrator , Xpedition Package Designer ,

New Electronics - Siemens partners with TSMC for 3nm product certifications

Siemens Digital Industries Software has announced TSMC has certified a broad array of EDA solutions from Siemens Digital Industries Software for the foundry’s newest process technologies. ....

Simcenter Flotherm , Siemen Simcenter Flotherm , Dan Kochpatcharin , Cloud Alliance , Ecosystem Forum , Design Infrastructure Management Division , Dfabric Alliance , Calibre Yieldenhancer , Siemen Analog , Aware Simulation , Siemen Solido Variation Designer , Innovation Platform , Xpedition Substrate Integrator , Xpedition Package Designer , Through Silicon Vias , Siemen Calibre ,

Siemens EDA certified for TSMC 3/4nm

TSMC has certified an array of Siemens’ EDA products for its 3nm and 4nm processes, while establishing 3D IC enablement, further advancement of EDA in ....

Simcenter Flotherm , Siemen Simcenter Flotherm , Cloud Alliance , Dfabric Alliance , Calibre Platform , Calibre Yieldenhancer , Siemen Analog , Aware Simulation , Siemen Solido Variation Designer , Xpedition Substrate Integrator , Xpedition Package Designer , Through Silicon Vias , High Bandwidth Memories ,

Siemens and ASE extend deal on 3D packaging

ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics.
“By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through integration with the current ASE design flow, we can now leverage this mutually developed flow to significantly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration,” said Dr. C.P. Hung, vice president, ASE Group. “Through the comprehensive design flow, we can now more quickly and easily co-design with our cu ....

Siemens Digital Industries Software , Semiconductor Engineering , Mentor Graphics , Advanced Semiconductor Engineering , Out Chip , Middle End , Xpedition Substrate Integrator , Siemens Xpedition Substrate Integrator , ஸீமெந்ஸ் டிஜிட்டல் தொழில்கள் மென்பொருள் , குறைக்கடத்தி பொறியியல் , வழிகாட்டி கிராபிக்ஸ் , ஔட் சிப் , நடுத்தர முடிவு ,