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HW News - New Intel GPUs Power On, 3nm & 2nm Engineering, Samsung Phone Chip Shortage

By
Eric Hamilton
Published February 03, 2021 at 3:40 am
This week, we’re covering Intel’s GPU getting a showcase, the Right to Repair movement gaining an impressive amount of traction among the states for 2021, and new product launches. On the Right to Repair front, several states will be proposing bills aimed at addressing repair laws, and the next few weeks and months will be interesting as these bills potentially get off the ground.
We’ve also got some news on the silicon manufacturing industry at large, discussing the future of GAA FETs as well as Micron’s new DRAM process. Cooler Master recently held its Virtual Showcase, and revealed a couple of noteworthy products worth looking at. ....

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Report: Intel Will Outsource Core i3 Production to TSMC's 5nm Node

This would be the first time the chip giant has built one of its Core CPUs on a different company s . ....

Pat Gelsinger , Redwood Cove , Meteor Lake , Alder Lake , Tiger Lake , Alder Lake S , Rocket Lake , Embedded Multi Die Interconnect Bridge , பேட் கெள்சிங்கேர் , ரெட்வுட் கோவ் , விண்கல் ஏரி , ஆல்டர் ஏரி , புலி ஏரி , ஆல்டர் ஏரி கள் , ராக்கெட் ஏரி , பதிக்கப்பட்ட பல இறக்க ஒன்றோடொன்று இணைக்கவும் பாலம் ,

The embedded die packaging market has been expected to grow at a CAGR of 15% during the forecast period (2020 - 2025)

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New York, Dec. 29, 2020 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report Embedded Die Packaging Market - Growth, Trends, Forecasts (2020 - 2025) - https://www.reportlinker.com/p06000980/?utm source=GNW
Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today s high-density mobile devices.
- Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies a ....

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