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The next generation platforms set to transform the industry

We have entered a new phase for platforms – Platform 3.0 – which will transform wealth management for consumers and the businesses that serve them. ....

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The Morning Briefing: Next generation of platforms

Good morning and welcome to your Morning Briefing for Tuesday 3 January, 2023. To get this in your inbox every morning click here. Platform 3.0 Platforms are one of the big topics in the advice sector and subject of endless speculation. This is due to their importance frankly: a tremendous amount of money is ....

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The embedded die packaging market has been expected to grow at a CAGR of 15% during the forecast period (2020 - 2025)

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New York, Dec. 29, 2020 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report Embedded Die Packaging Market - Growth, Trends, Forecasts (2020 - 2025) - https://www.reportlinker.com/p06000980/?utm source=GNW
Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today s high-density mobile devices.
- Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies a ....

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