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Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology TOKYO, June 3, 2024 /PRNewswire/ Rapidus Corporation, a manufacturer of. ....
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.
Inside a semiconductor 'clean room' at Japan's top university thestar.com.my - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from thestar.com.my Daily Mail and Mail on Sunday newspapers.
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM , today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this. ....