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Winbond introduces CUBE architecture for powerful Edge AI devices – CIE

Winbond introduces CUBE architecture for powerful Edge AI devices – CIE
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New Electronics - Winbond introduces CUBE architecture for Edge AI devices

Winbond Electronics has unveiled a powerful enabling technology that enables more affordable Edge AI computing in mainstream use cases. ....

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Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements. ....

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