Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies – EEJournal
Company’s chiplet packaging method is critical to realizing the scale of performance and integration required in a broad range of compute-intensive applications for hyperscalers, data centers, cloud computing, AI, and graphic Series A funding round raises $40m led by Tracker Capital with additional investment from Celesta Capital and strategic investors including Intel Capital and Micron…
Source: eejournal.com