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New Electronics - Eliyan achieves first silicon for breakthrough NuLink PHY technology - Vimarsana News

New Electronics - Eliyan achieves first silicon for breakthrough NuLink PHY technology

Eliyan, the developer of what is said to be the highest-performing and most efficient chiplet interconnect, has announced silicon availability for its NuLink PHY technology.

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era - Vimarsana News

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

/PRNewswire/ -- Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect,...

Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies – EEJournal - Vimarsana News

Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies – EEJournal

Company’s chiplet packaging method is critical to realizing the scale of performance and integration required in a broad range of compute-intensive applications for hyperscalers, data centers, cloud computing, AI, and graphic Series A funding round raises $40m led by Tracker Capital with additional investment from Celesta Capital and strategic investors including Intel Capital and Micron…