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Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry's First Working Silicon Compliant with the Spec

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,. ....

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Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,. ....

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Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist

Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist
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Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,. ....

Behzad Razavi , Ramin Farjadrad , Sharif University Of Technology , Prnewswire Eliyan Corporation , Stanford University , Technical Program Committees Of The International Solid , Princeton University , International Journal Of High Speed Electronics , Us National Academy Of Inventors , International Solid , Us National Academy Of Engineering , Chief Technologist , Solid State Circuits , Bell Laboratories , Associate Professor , Sharif University , Technical Program Committees , International Solid State Circuits Conference , International Journal , High Speed ,