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Eliyan Applauds Release of OCP's Latest Multi-die Open Inter
Eliyan Applauds Release of OCP's Latest Multi-die Open Inter
Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry's First Working Silicon Compliant with the Spec
/PRNewswire/ -- Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect,...
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