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JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration

JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration
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Mian Quddus , Cliff Grossner , Solid State Technology Association , New Release , Model Guidelines , Empowering Chiplet , State Technology Association , Open Compute Project Foundation , Data Extensible Markup Language , Open Chiplet Economy , Chief Innovation Officer ,

Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry's First Working Silicon Compliant with the Spec

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,. ....

Bapi Vinnakota , Ramin Fajadrad , Prnewswire Eliyan Corporation , Open Compute Project , Open Domain Specific Architecture , Multi Gbps Enterprise Ethernet , Open Chiplet Economy , Open Compute Project Foundation ,