Apple UltraFusion relies on TSMC 3DFabric packaging technology
Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.
Source: digitimes.com
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Global 1Q23 enterprise SSD revenue falls by nearly half
Due to a slump in both volume and prices, revenue in the enterprise SSD market fell 47.3% sequentially to nearly US$2 billion in the first quarter of 2023, according to TrendForce.
Source: digitimes.com
AI may not stimulate consumer electronics replacement demand until 2024
Artificial intelligence (AI) may not trigger replacement demand for consumer electronics until at least 2024, according to sources at IC design houses.
Source: digitimes.com
FHD to become mainstream for computing products, says OmniVision
Full HD (FHD), or 1080p, will overtake 720p as the standard for computing products, according to CMOS image sensor (CIS) supplier OmniVision Technologies.
Source: digitimes.com
With AI trending, cooling solutions are also receiving attention
In the face of a global demand slowdown, AI remains a hot topic and gradually shows its importance across all industries. However, with computing power continuously expanding and data storage access increasingly frequent, the issue of power consumption is also becoming more and more apparent. Because of this, heat dispersion/cooling solutions are receiving much attention.
Source: digitimes.com