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Lear Leads Latest Investment Round in Flexible Circuit Maker CelLink Lear Corporation, a global automotive technology leader in Seating and E-Systems, announced that it is the lead investor for the Series C round of financing in CelLink Corporation, a San Carlos, CA-based manufacturer of a new class of flat and flexible circuits that minimize complexity, space and weight.  With simplified designs, automated production and handling, and optimized electrical and thermal performance, CelLink's technology is a key enabler for el...

05/03/2021 | Press release | Distributed by Public on 05/03/2021 07:17 Lear Corporation announced that it is the lead investor for the Series C round of financing in CelLink Corporation, a San Carlos, CA-based manufacturer of a new class of flat[...] Southfield, Mich. (May 3, 2021) -- Lear Corporation(NYSE: LEA), a global automotive technology leader in Seating and E-Systems, today announced that it is the lead investor for the Series C round of financing in CelLink Corporation, a San Carlos, CA-based manufacturer of a new class of flat and flexible circuits that minimize complexity, space an...