Thermal interface gel for thin bond lines
Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL - thin bond line) offers 5W/m.K bulk thermal conductivity and,
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Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL - thin bond line) offers 5W/m.K bulk thermal conductivity and,
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News July 31, 2023 Mitsubishi Materials Corporation Release of Mitsubishi Materials Integrated Report 2023 -Introducing the Medium-term...
Operator: Ladies and gentlemen, thank you for standing by. [Operator Instructions] And welcome to Avery Dennison's Earnings Conference Call for the Second Quarter ended on July 1, 2023.
Highlights: 2Q23 Net sales of $2.1 billion Sales change ex. currency down 10% Organic sales change down 10% 2Q23 Reported EPS of $1.24 Increased accrual for legacy legal matter;...