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Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business. The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging t

By Max A. Cherney (Reuters) - Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, follow...

(Reuters) -Advanced Micro Devices on Tuesday forecast a strong finish to the year, driven by the planned launch of artificial-intelligence chips that could compete with Nvidia semiconductors. AMD shares rose about 3% in after-hours trading. CEO Lisa Su said AMD is set to ramp up production of its flagship MI300 artificial-intelligence chips in the fourth quarter.

By Max A. Cherney, Chavi Mehta and Stephen Nellis (Reuters) -Chipmaker Intel on Thursday posted a surprise quarterly profit as a PC market slump started to ...

By Max A. Cherney and Chavi Mehta (Reuters) -Chipmaker Intel on Thursday posted a surprise profit as a PC market slump started to ease, and it forecas...