Vimarsana
Biggest News Aggregation in the World

Page 2 - Memory Interface News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Stay updated with breaking news from Memory Interface. Get real-time updates on events, politics, business, and more. Visit us for reliable news and exclusive interviews.

Top News In Memory Interface Today - Breaking & Trending Today

Reorder Core - Vimarsana News

Reorder Core

The Reorder Core from Rambus reorders requests based on first on priority and second on throughput optimization. Throughput optimization includes moving ...

RTX A2000: Workstation-GPU von Nvidia im Low-Profile-Format kommt im Oktober - Vimarsana News

RTX A2000: Workstation-GPU von Nvidia im Low-Profile-Format kommt im Oktober

Nvidia mit der RTX A2000 seine bisher kleinste Workstation-Grafikkarte veröffentlicht. Die Low-Profile-GPU erinnert an die Geforce RTX 3060.

GDDR6 PHY - TSMC12FFc IP Core - Vimarsana News

GDDR6 PHY - TSMC12FFc IP Core

GDDR6 PHY - TSMC12FFc With the advancement of artificial intelligence (AI), deep neural networks (DNN), ADAS, and high-performance computing (HPC), there is an ever-increasing demand for higher memory bandwidth. Along with the large amount of data generated by these applications, the memory sub-system plays a crucial role in the overall performance. TSS GDDR6 PHY utilizes state-of-the-art architecture in full custom analog mixed-signal design to overcome the problem of long-term impedance drift and clock phase drift, allowing impedance and clock phase updates without the need to interr...

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm - Vimarsana News

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Share this article (PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 21, 2021 /PRNewswire/ -- Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung's advanced 14/11nm FinFET process. Leveraging over 30 years of signal integrity expertise, the Rambus solution operates up to 3.2 Gbps, delivering 410 GB/s of bandwidth. This performance meets the terabyte-scale bandwidth needs of accelerators tar...

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP - Vimarsana News

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP

(PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 19, 2021 /PRNewswire/ --  Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agency's programs. The agreement makes all Rambus security, memory interface, and SerDes interface IP products available to DARPA researchers. As licensees, DARPA researchers benefit by having access to IP offering renowned security protection and the w...