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Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm - Vimarsana News

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Share this article (PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 21, 2021 /PRNewswire/ -- Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung's advanced 14/11nm FinFET process. Leveraging over 30 years of signal integrity expertise, the Rambus solution operates up to 3.2 Gbps, delivering 410 GB/s of bandwidth. This performance meets the terabyte-scale bandwidth needs of accelerators tar...

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP - Vimarsana News

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP

(PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 19, 2021 /PRNewswire/ --  Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agency's programs. The agreement makes all Rambus security, memory interface, and SerDes interface IP products available to DARPA researchers. As licensees, DARPA researchers benefit by having access to IP offering renowned security protection and the w...