Siemens and ASE extend deal on 3D packaging
ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics. “By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through int...
Source: eenewseurope.com