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New Electronics - congatec simplifies COM-HPC designs

New Electronics - congatec simplifies COM-HPC designs
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Christian Eder , Module Base Specification , Base Specification , Carrier Board Design Guide , Platform Management Interface , Design Guide , Director Marketing , Gen Intel Core , Alder Lake , Intel Xeon ,

COM-HPC Carrier Design Guide compliant ecosystem

San Diego, CA, 10 February, 2022  congatec – a leading vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.… ....

San Diego , United States , Christian Eder , Module Base Specification , Industrial Computer Manufacturers Group , Board Design Guide , Computer Manufacturers Group , Base Specification , Carrier Board Design Guide , Platform Management Interface , Design Guide , Director Marketing , Gen Intel Core , Alder Lake , Intel Xeon ,