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MOUNTAIN VIEW, Calif. – July 11, 2022 – Flex LogixÒ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has been selected to be part of a team of microelectronic industry leaders, led by Microsoft, to build a chip development platform with the utmost regard for security as demonstrated by…

Flex Logix Technologies, a supplier of embedded FPGA (eFPGA) IP, architecture and software, has been selected to be part of a team of microelectronic companies, led by Microsoft, to build a chip development platform for security as demonstrated by the DoD RAMP Project.

Cadence Design Systems has released the results of the 2021 three-way collaboration with TSMC and Microsoft, which focused on utilising a cloud infrastructure to accelerate digital timing signoff of 10+ billion transistor designs.

SAN JOSE, Calif., Dec. 2, 2021 -- Cadence Design Systems, Inc. announced the results of the 2021 three-way collaboration with TSMC and Microsoft, which

Highlights: • Customers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform • Cadence Tempus Timing Signoff Solution demonstrated distributed scalability on a 10+ billion transistor design while reducing compute costs for maximum efficiency SAN JOSE, Calif., December 1, 2021—Cadence Design…