Multi Chip Package News Today : Breaking News, Live Updates & Top Stories | Vimarsana

OWEGO, N.Y. Lockheed Martin, Intel Corp., and Altera, an Intel Company, are joining hands to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E). Lockheed Martin will develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system, leveraging the Altera Multi-Chip Package (MCP2) for expected use on the U.S. Navy’s M...

Lockheed Martin will collaborate with Intel and its newly launched standalone business Altera to build a sensor open systems architecture-based airborne electronic defense platform for the U.S. Navy's MH-60R multi-mission helicopter to support a program of the Office of the Undersecretary of Defense for Research and Engineering. Lockheed said Monday it will use Altera's Multi-Chip Package for integration with the SOSA technology under the Stimulating Transition for Advanced Microelectronics Packaging program.

Intel has revised its Xeon Scalable family naming to a simpler "Xeon 6" branding for its next-gen Sierra Forest & Granite Rapids CPUs.

OWEGO, N.Y.April. 8, 2024- Lockheed Martin will work with Intel Corporation , and Altera, an Intel Company,to support the Stimulating Transition for Advanced Microelectronics Packaging ...

Lockheed Martin will work with Intel Corporation and Altera, an Intel company, to support the STAMP program of the Office of the Under Secretary of Defense for Research and Engineering . Lockheed...